Atlanta, Georgia– AMI, the global leader in Dynamic Firmware for worldwide computing, is excited to announce it is among top partners in Arm Total Design , an ecosystem committed to frictionless delivery of custom SoCs based on Arm. This strategic membership marks a significant milestone in AMI’s support of the Arm Neoverse™ ecosystem helping deliver performance-optimized compute to the market quickly and accelerating the adoption of custom silicon based on Arm technology.

AMI is the most experienced independent firmware vendor in the industry. At AMI, we bring decades of experience and knowledge and have integrated our firmware solutions into billions of computing platforms worldwide. By becoming one of the top partners in Arm Total Design , AMI will aim to leverage its resources and expertise to create synergy and deliver workload-optimized custom silicon solutions to the market.

“We are thrilled to be among the top partners in Arm Total Design , providing foundational firmware for Arm Neoverse CSS. This collaboration underscores our commitment to accelerating the adoption of Arm technology and growing its ecosystem,” says Sanjoy Maity, CEO of AMI.

“Bringing industry-leading silicon to market requires input and expertise from across every stage of SoC development,” said Mohamed Awad, senior vice president and general manager, Infrastructure Line of Business, Arm. “The Arm Total Design program brings together critical ecosystem players, and by working closely with leading infrastructure firmware vendors like AMI, we are ensuring custom silicon based on Neoverse CSS can take full advantage of the extensive Arm software ecosystem to achieve faster time to market.”

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Arm and Neoverse are registered trademarks or trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere. All other trademarks and registered trademarks are the property of their respective owners.

ATLANTA, GEORGIA – AMI^®, the global leader in Dynamic Firmware for worldwide computing, is excited to announce its participation in the upcoming 2023 Open Compute Project (OCP) Global Summit on October 17-19 in San Jose, California. This premier industry event promises to be a dynamic platform for the open-source community, and AMI is gearing up to make a significant impact with its innovative offerings.

OCP Global Summit is known for bringing together the best and brightest from the open-source community, offering a unique opportunity for collaboration, and learning. AMI is proud to be an exhibitor at this prestigious event, where it will showcase its latest innovations. Our team members will participate in panel discussions and deliver thought leadership and technical presentations on the latest industry topics and trends.

Key highlights of AMI at the OCP Global Summit will include:

• • • Executive presentations – on unifying open-source foundational firmware by Sanjoy Maity, CEO of AMI, and on the impact of firmware in the future of the secure and modular data center by Kelly Bryant, Chief Product Officer at AMI.
    • Technical presentations – on enabling DC-MHS design, Platform Root of Trust (ProT) on DC-SCM 2.0 and DC MHS, secure system design, and more.
    • Demonstration of the latest Innovations from AMI – on ProT including SPDM attestation via LPTI and DC-SCM 2.0, firmware orchestration on DC-MHS, data center telemetry logging, firmware lifecycle management, and our next-generation BIOS/UEFI and BMC firmware.
    • AMI’s membership into the Caliptra –a program industry leaders have come together as part of the Open Compute Project (OCP) Community to define a reusable silicon-level IP block for integration into future SoCs.
    • AMI Data Center Manager (DCM) – a powerful tool that can help organizations manage their data centers with greater reliability, efficiency, and sustainability.

“We are eagerly looking forward to the 2023 OCP Global Summit as it presents an exciting opportunity for AMI to shine a spotlight on our industry-leading expertise and groundbreaking solutions, helping shape the future of the open-source community,” says Sanjoy Maity, CEO of AMI.

Visitors to AMI’s booth A33 can expect to see how AMI is innovating at the intersection of foundational technology and the open-source community. Our experts will be on hand to provide in-depth demonstrations and answer questions. To learn more about AMI’s participation in this year’s event, please visit our 2023 OCP Global Summit page.

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AMI is a registered trademark and MegaRAC OneTree is a trademark of AMI in the US and/or elsewhere. All other trademarks and registered trademarks are the property of their respective owners.

AMI®, the leader in foundational technology for sustainable, scalable, and secure global computing, is set to drive the future of Intel Data Center Manager (DCM) as it takes over the development, sales, and support of DCM under an agreement with Intel.  

To learn more, please read the official press release. 

Hello, OCP Tech Enthusiasts and Visionaries!

We are thrilled to announce an upcoming demonstration at the OCP Global Summit 2023 featuring the latest innovation from AMI, MegaRAC OneTree (OT) BMC firmware. AMI has partnered with Intel® to showcase multi-vendor and multi-architecture BMC firmware support using an OpenBMC-based manageability solution running on an Intel 4th Gen Xeon Processor Platform. We are excited to present MegaRAC OneTree at OCP, marking the first public exhibition of this technology.

The Power of Defragmentation

Linux Foundation’s OpenBMC is renowned for its open-source flexibility and collaboration among the world’s leading silicon vendors, ODMs, OEMs, data centers, and CSPs. However, like any powerful open-source project, it is highly subject to fragmentation as major players develop key features and vendor-specific solutions in separate repositories – both open and closed. AMI leverages decades of expertise in BMC firmware development and collaboration with major industry players to defragment the market by delivering a truly cross-vendor, cross-architecture, and cross-generation solution in a single codebase or tree; hence, MegaRAC OneTree. This ensures that modularity, innovation, and support never come at the expense of compatibility.

Low-Risk, High Reward

In an era where security is paramount, MegaRAC OneTree shines by extending the rigorous validation processes in place for previous solutions onto the OpenBMC stack. It offers a secure and hardened codebase that has undergone multiple QA cycles, third-party code scanning tools, and in-house test suites, guaranteeing a robust defense against vulnerabilities. For enterprise customers and hyperscalers eyeing a migration to an OpenBMC architecture, MegaRAC OneTree is the low-risk, high-reward solution of choice. It harnesses AMI’s decades of experience delivering reliable and resilient product offerings, tooling, and engineering support services across the entire compute ecosystem. This empowers developers with the efficiency they need while minimizing migration challenges.

AMI’s Commitment to Open-Source

AMI’s commitment to the open-source community is not just about innovation but also active contribution. Several Linux Foundation OpenBMC contributions are currently under review, demonstrating AMI’s dedication to the community’s growth. What’s more, AMI has taken on maintainer roles in various Linux Foundation OpenBMC repositories, ensuring continuous support, collaboration, and enhancements.

Join Us at OCP Global Summit 2023

Join us at booth A33 to experience these remarkable demos firsthand and discuss them with our technologists. We can’t wait to see you there!

AMI, ASPEED Technology, and Jabil are proud to showcase a technical demonstration at the OCP Global Summit 2023. This collaborative effort showcases a secure DC-SCM (Data Center Secure Control Module) add-on card that promises to redefine hardware security and firmware attestation. Our secure DC-SCM add-on card is a first-of-its-kind reference design solution purpose-built to seamlessly integrate with a standard DC-MHS (Data Center Modular Host System) platform.

A Powerhouse Trio

Our showcase revolves around the collaborative DC-SCM design from ASPEED and AMI, AMI’s Meridian Services, and Jabil’s DC-MHS platform. The ASPEED/AMI DC-SCM 2.0 card includes the ASPEED AST2600 BMC powered by the industry-leading AMI MegaRAC platform management solution. It also features the ASPEED AST1060 PRoT (Platform Root of Trust) SoC to enhance firmware security on enterprise platforms. Harnessing Jabil’s Mustang platform, we’ll demonstrate a transition from a Jabil DC-SCM to the ASPEED/AMI DC-SCM, a seamless connection to AMI’s Meridian Services, an effortless update of AMI’s MegaRAC BMC firmware and Tektagon PRoT firmware, ensuring a secure, future-proof data center environment. This demonstration exemplifies our commitment to innovation, flexibility, and precision in meeting the dynamic needs of the data center landscape.

“We are excited to join forces with AMI and Jabil in unveiling the ASPEED/AMI DC-SCM 2.0 card, featuring both the AST2600 BMC and AST1060 PRoT SoC from ASPEED,” stated Chris Lin, Chairman of ASPEED. “The AST2600 BMC signifies a groundbreaking advancement in hardware management and remote server control, delivering enhanced efficiency and dependability to data center operations. In tandem with AST2600, the AST1060 PRoT SoC offers comprehensive firmware security for enterprise platforms, ensuring the integrity of critical data, shielding against tampering and compromising, detecting any data manipulation, and enabling the restoration of vital information to its original state. Our partnership with AMI and Jabil exemplifies the seamless integration of our AST2600 BMC and AST1060 PRoT SoC with their solutions, collectively forging a fortified, forward-thinking data center ecosystem.”

“Choosing the ASPEED-designed DC-SCM module for this demonstration perfectly highlights how the DC-MHS specifications enable multi-vendor modular server solutions,” stated Ed Bailey, Technology VP of Jabil. “The Jabil and ASPEED teams were able to come together after independently developing their own DC-MHS compliant components and integrate them into a single system. The AMI team was brought into the collaboration to automate the “plug and recode” aspect of this demonstration. Their firmware orchestration and automation services not only made the DC-MHS swap seamless but added additional security via the AMI Tektagon Platform Root of Trust solution running on the AST1060 PRoT SOC.”

Connecting It All Together

Behind the scenes, AMI Meridian Services, an integral part of AMI’s Dynamic Firmware concept, brings a new level of sophistication to firmware orchestration and automation. AMI Meridian Services extends to critical components such as firmware configuration, software bill of materials (SBOM) generation, build automation, and comprehensive testing, in order to provide an end-to-end solution for Dynamic Firmware management. Expect to see the AMI Meridian – Build Orchestrator Services in action to build and deploy AMI Tektagon and MegaRAC firmware solutions to the DC-SCM.

Flexibility and Customization for Secure Data Center Solutions

This solution will deliver the highest level of flexibility and platform security to cloud service providers, data center operators, and server ODMs.

“ODMs can now align to the specific needs of the data center through flexibility in platform management in a truly secure foundational environment. This partnership between AMI, ASPEED, and Jabil demonstrates how all three companies will be working together to ensure platform security on these next-gen Intel platforms,” says Stefano Righi, Senior Vice President of Global Security, AMI.

Join Us at OCP Global Summit 2023

Join us at booth A33 to experience these remarkable demos firsthand and discuss them with our technologists. We can’t wait to see you there!

Hello, tech enthusiasts and visionaries! We are delighted to present a preview of an extraordinary collaboration at the Open Compute Project (OCP) Global Summit 2023. AMI and AMD are joining forces to unveil the latest updates on the AMD openSIL project and AMI’s boot firmware (UEFI) enablement of AMD openSIL-based silicon. Buckle up because this kind of collaboration can set the stage for a new era in hardware and firmware synergy.

AMD openSIL Introduction: Bridging Innovation and Scalability

Imagine a world where the full potential of silicon can be unlocked through seamless integration with open-source firmware. This is where AMD openSIL (Silicon Initialization Layer) comes in – a groundbreaking initiative that introduces new possibilities. At its core, AMD openSIL is an open-source silicon initialization library that offers a modular and scalable foundation for firmware development. It is designed to be compatible with a wide range of host firmware platforms such as UEFI and coreboot. AMD openSIL’s collection of APIs and hardware initialization/abstraction layers can help enhance the speed and accessibility of firmware development for various AMD platforms.

AMI’s BIOS/UEFI Prowess Meets AMD openSIL

And here’s where the magic happens. AMI, a leader in BIOS/UEFI, BMC, and Platform Root of Trust (PRoT) solutions, is proud to announce its collaboration with AMD to enhance the AMD openSIL experience. Boot firmware is an integral component for any properly functioning platform silicon and AMI’s Aptio CommunityEdition firmware (formerly Aptio OpenEdition) is designed to deliver a pure AMD openSIL compatible UEFI solution to the OCP open-source firmware community. The Aptio CommunityEdition solution eliminates all AMD Generic Encapsulated Software Architecture (AGESA™) dependencies, allowing for a seamless integration of AMD openSIL and platform bring-up process. This collaboration between AMI and AMD will bring cutting-edge technology to the forefront of the industry, offering a superior user experience to all.

OCP Community Relevance

Why should the OCP community care about scalability, openness, sustainability, and multi-vendor support? The answer lies in the OCP core values and the theme for this year’s Global Summit, “Scaling Innovation Through Collaboration.” The AMD openSIL and AMI Aptio CommunityEdition combination is designed to offer seamless scalability through dynamic hardware configuration, allowing for effortless adaptation to varying workloads. Additionally, this solution underscores the importance of openness, allowing developers to innovate and customize solutions that best meet their specific needs, ranging from low firmware footprint allowing low attack surface to feature-rich solutions. Furthermore, this joint effort emphasizes sustainability, reducing development cycles, minimizing resource consumption, and optimizing platform performance. Lastly, supporting multiple vendors promotes healthy competition and collaboration in the marketplace.

Join Us at OCP Global Summit 2023

Check out this collaboration and many other AMI activities at AMI booth A33. See you at the Summit!

DISCLAIMER

The information presented in this document is for informational purposes only and may contain technical inaccuracies, omissions, and typographical errors. The information contained herein is subject to change and may be rendered inaccurate for many reasons, including but not limited to product and roadmap changes, component and motherboard version changes, new model and/or product releases, product differences between differing manufacturers, software changes, BIOS flashes, firmware upgrades, or the like. Any computer system has risks of security vulnerabilities that cannot be completely prevented or mitigated. AMD assumes no obligation to update or otherwise correct or revise this information. However, AMD reserves the right to revise this information and to make changes from time to time to the content hereof without obligation of AMD to notify any person of such revisions or changes.

THIS INFORMATION IS PROVIDED ‘AS IS.” AMD MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS, OR OMISSIONS THAT MAY APPEAR IN THIS INFORMATION. AMD SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY, OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL AMD BE LIABLE TO ANY PERSON FOR ANY RELIANCE, DIRECT, INDIRECT, SPECIAL, OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE OF ANY INFORMATION CONTAINED HEREIN, EVEN IF AMD IS EXPRESSLY ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

AMD, the AMD Arrow logo, AGESA and combinations thereof are trademarks of Advanced Micro Devices, Inc. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.

As contributors to the Open Compute Project (OCP) and foremost firmware/ silicon providers supporting OCP standards, AMI and Lattice Semiconductor are excited to demonstrate interoperability of the AMI Tektagon and Lattice-based Platform Root of Trust (PRoT) solution on third-party DC-SCM 2.0 cards. This demonstration is scheduled to take place at the OCP, in San Jose from October 17th to 19th in the San Jose Convention Center. The detailed walk-through and breakout session in the security track will show platform attestation using the Lattice Mach™-NX FPGA with Hardware Root of Trust on a DC-SCM 2.0 card, communicating to a Lattice-simulated Host Processor Module (HPM) with LVDS Tunneling Protocol and Interface (LTPI).

DC-SCM 2.0 Delivers Important Advantages with LTPI

Modular platform architectures in data centers offer several benefits, such as scalability, flexibility, and easier maintenance. However, component and resource costs must be minimized in an effort to make the modular approach more optimal. Availability of I/Os and reduced scope of board components, such as connectors, should be considered as standard specifications are created.

Designed for tunneling various low-speed signals between the HPM and SCM, LTPI is able to deliver more bandwidth and scalability, with multiplexing and tunneling of several various signal types including GPIO, SMBus, I2C, and UART. This consolidation helps enable DC-SCM 2.0 with reduced costs and complexity with better performance, creating a more optimized approach toward a modular design.

Lattice Provides a Glimpse into the LTPI Future

One of the key pieces that enables the DC-SCM PRoT demo is the simulated LTPI HPM, running on a Lattice FPGA. Normally taking the form of an FPGA, the Lattice FPGA performs the same CPLD functions as well as enabling the LTPI tunneling of the I2C and SMBus interfaces to the HPM for PRoT command/control and filtering.

Platform Root of Trust Resiliency with AMI Tektagon and Lattice Mach-NX in a Modular DC-SCM Design

The modular approach to PRoT provides great benefits to CSPs and data center managers. By using a DC-SCM enabled server, data center managers have the flexibility of choosing the right BMC solution to minimize efforts for compatibility while securing their platform firmware. This also allows for some optimizations that can be made in functionality at the server ODMs to accommodate this flexibility.

The demonstration and subsequent security track session will show how the modular DC-SCM 2.0 architecture provides a solution for fully compliant NIST 800-193 platform firmware resiliency. Attendees will be able to see the attestation of BIOS and BMC platform firmware as well as how peripheral attestation is done using SPDM over MCTP.

Experience the Demonstration and Security Track Session

Attendees of the 2023 OCP Global Summit can experience the demonstration of the PRoT DC-SCM solution with LTPI from October 17th through the 19th at the AMI Expo Hall Booth #A33. Those interested in seeing the security track session: “Leveraging FPGA-based root of trust for efficient, dynamic, and remote platform attestation” can do so on October 19th in room 210CG at the Concourse level of the San Jose Convention Center.

AMI will demonstrate its latest developments in implementing a scalable heterogenous firmware life cycle management and orchestration service on Ampere Computing’s OCP-approved Mt. Jade and Mt. Mitchell platform at the upcoming Open Compute Project (OCP) Global Summit. This joint work, the first of many, will reshape the computing landscape by marking a significant shift in the firmware deployment and management processes across platform manufacturers and end users.

Mastering the Open-Source Firmware Lifecycle

Open-source has become the cornerstone of innovation in the technology world. AMI and Ampere’s partnership underscores the importance of collaboration in advancing the field of firmware development and management.

Today, fully automating the firmware life cycle at scale is a challenge. Although many firmware projects utilize modular architectures, the development-to-deployment process typically follows a monolithic approach that necessitates several supply chain partner hand-offs and manual platform porting steps to customize the firmware for each silicon vendor and platform generation. Data centers and cloud vendors with multi-vendor and multi-generation server clusters are required to track and monitor platform and device configuration, firmware configuration, and other pertinent details for guaranteeing zero-downtime firmware updates and security patches. Moreover, the complexity increases as we move from traditional platform architecture to a more dynamic, composable hardware architecture emphasizing interoperability (DC-SCM, DC-MHS).

“Compute is increasingly becoming dynamic. Firmware needs to adopt a flexible architecture and developer-friendly tooling to keep up with the demands – Dynamic Firmware”, says Chitrak Gupta, Chief Principal Architect, AMI.

Scaling Up: A Bold Step in Firmware Management

Developers stand to gain significant advantages by automating firmware configuration and integrating open-source and in-house solutions across different platform vendors and generations. This is particularly crucial for firmware projects that employ specific open-source components or are established on an open-source-based repository. To ensure a successful firmware development lifecycle process, it is imperative to possess resilient systems that support automated testing, as well as code-scanning and vulnerability detection tools. Additionally, such systems should provide the ability to sign images, generate regulatory reports (COO, SBOM, etc.), and deploy signed and verified firmware images to distributed compute nodes.

Navigating the Complex with Simplicity

AMI’s build orchestration service aims to provide a different approach to tackling the traditional firmware development life cycle:

• Leverages silicon features to build intelligence for detecting hardware configuration changes.
• Develops easy-to-integrate firmware configuration and build pipelines (CI/CD) that deliver enhanced modularity and flexibility to fit platform specifications and business needs.
• Provides a marketplace for incorporating third-party SCA tools.
• Generates SBOM, COO, and other reports that guarantee your binary complies with government and organizational guidelines.
• Secures the firmware update process by leveraging image signing and remote attestation mechanisms to ensure the accuracy and authenticity of the deployed firmware.
• Gathers telemetry data to verify the functionality of the newly deployed firmware before scaling distribution across larger clusters.

Witness the Future Unfold at OCP Global Summit 2023

Prepare to be inspired! As we eagerly anticipate the OCP Global Summit 2023, the AMI and Ampere demonstration stands as a testament to the spirit of innovation and collaboration that drives the technology industry forward. Come to our booths (A33 – AMI | B28 – Ampere) to view the live demo while discussing this and other topics with our technologists.

We look forward to seeing you there!